公开(公告)号：US20190393109A1

公开(公告)日：2019-12-26

申请号：US16481216

申请日：2017-03-30

Applicant: Intel Corporation

Inventor： Lisa Ying Ying CHEN ,  Lauren Ashley LINK ,  Robert Alan MAY ,  Amruthavalli Pallavi ALUR ,  Kristof Kuwawi DARMAWIKARTA ,  Siddharth K. ALUR ,  Sri Ranga Sai BOYAPATI ,  Andrew James BROWN ,  Lilia MAY

IPC: H01L23/15 ,  H01L23/498 ,  H01L21/48 ,  C04B35/622 ,  C04B35/64

Abstract: Semiconductor packages including package substrates having polymer-derived ceramic cores are described. In an example, a package substrate includes a core layer including a polymer-derived ceramic. The polymer-derived ceramic may include filler particles to control shrinkage and reduce warpage of the core layer during fabrication and use of the package substrate. The core layer may include counterbores or blind holes to embed a contact pad or an electrical interconnect in the core layer. A semiconductor die may be mounted on the package substrate and may be electrically connected to the contact pad or the electrical interconnect.