公开(公告)号：US20190043778A1

公开(公告)日：2019-02-07

申请号：US16061324

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： Zhizhong TANG ,  Shinobu KOURAKATA ,  Kazuo OGATA ,  Paul R. START ,  Syadwad JIAN ,  William Nicholas LABANOK ,  Wei HU ,  Peng LI ,  Douglas R. YOUNG ,  Gregory S. CONSTABLE ,  John J. Beatty ,  Pardeep K. BHATTI ,  Luke J. GARNER ,  Aravindha R. ANTONISWAMY

IPC: H01L23/367 ,  H01L21/48 ,  H01L25/065

Abstract: Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.

公开(公告)号：US20200185290A1

公开(公告)日：2020-06-11

申请号：US16614765

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Dinesh PADMANABHAN RAMALEKSHMI THANU ,  Hemanth K. DHAVALESWARAPU ,  Venkata Suresh GUTHIKONDA ,  John J. BEATTY ,  Yonghao AN ,  Marco Aurelio CARTAS AYALA ,  Luke J. GARNER ,  Peng LI

IPC: H01L23/16 ,  H01L23/367 ,  H01L25/16 ,  H01L21/52 ,  H01L23/538 ,  H01L23/498 ,  H01L25/065

Abstract: Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.