公开(公告)号：US20200185290A1

公开(公告)日：2020-06-11

申请号：US16614765

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Dinesh PADMANABHAN RAMALEKSHMI THANU ,  Hemanth K. DHAVALESWARAPU ,  Venkata Suresh GUTHIKONDA ,  John J. BEATTY ,  Yonghao AN ,  Marco Aurelio CARTAS AYALA ,  Luke J. GARNER ,  Peng LI

IPC: H01L23/16 ,  H01L23/367 ,  H01L25/16 ,  H01L21/52 ,  H01L23/538 ,  H01L23/498 ,  H01L25/065

Abstract: Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.

公开(公告)号：US20180374776A1

公开(公告)日：2018-12-27

申请号：US15774990

申请日：2016-01-11

Applicant: Intel Corporation

Inventor： Boxi LIU ,  Hemanth K. DHAVALESWARAPU ,  Syadwad JAIN ,  James C. MATAYABAS, Jr.

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

Abstract: A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to the substrate, a second semiconductor die coupled to the substrate, a heat spreader coupled to the die, wherein the first die has a first distance to the heat spreader and the second die has a second distance to the heat spreader, a first filled thermal interface material (TIM) between the first die and the heat spreader to mechanically and thermally couple the heat spreader to the die, and a second filled TIM between the second die and the heat spreader to mechanically and thermally couple the heat spreader to the second die.