公开(公告)号：US20240345324A1

公开(公告)日：2024-10-17

申请号：US18133353

申请日：2023-04-11

Applicant: Intel Corporation

Inventor： Benjamin Duong ,  Kristof Darmawikarta ,  Soham Agarwal ,  Marcel Said ,  Sandeep Gaan

IPC: G02B6/26

CPC classification number: G02B6/26

Abstract: An integrated circuit package includes a substrate with an integrated circuit device mounting surface, and at least one optical fiber mount in the substrate. The optical fiber mount includes a support having at least one optical fiber mounting channel, and the optical fiber mounting channel is configured to mount at least one clad optical fiber.