公开(公告)号：US20230101997A1

公开(公告)日：2023-03-30

申请号：US17490290

申请日：2021-09-30

Applicant: Intel Corporation

Inventor： Nikos Kaburlasos ,  Rodrigo De Oliveira Vivi ,  Phani Kumar Kandula ,  Marc Beuchat ,  Mark J. Luckeroth ,  Eric J.M. Moret ,  David N. Lombard ,  John Kelbert ,  Brad Bittel

IPC: G06F1/3296 ,  G06F1/3228 ,  G06F1/08

Abstract: Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.

公开(公告)号：US12253901B2

公开(公告)日：2025-03-18

申请号：US17490290

申请日：2021-09-30

Applicant: Intel Corporation

Inventor： Nikos Kaburlasos ,  Rodrigo De Oliveira Vivi ,  Phani Kumar Kandula ,  Marc Beuchat ,  Mark J. Luckeroth ,  Eric J. M. Moret ,  David N. Lombard ,  John Kelbert ,  Brad Bittel

IPC: G06F1/32 ,  G06F1/08 ,  G06F1/3228 ,  G06F1/3296

Abstract: Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.