公开(公告)号：US11804456B2

公开(公告)日：2023-10-31

申请号：US16107791

申请日：2018-08-21

Applicant: Intel Corporation

Inventor： William J. Lambert ,  Omkar Karhade ,  Martin Rodriguez ,  Gregorio R. Murtagian

IPC: H01L23/64 ,  H01L23/522 ,  H01L23/495 ,  H01L49/02

CPC classification number: H01L23/645 ,  H01L23/49582 ,  H01L23/5226 ,  H01L28/10

Abstract: A microelectronics package, comprising a substrate comprising a first bondpad and a second bondpad over a dielectric. An inductor comprising at least one wire extends over the dielectric. The at least one wire has a first end coupled to the first bondpad and a second end coupled to the second bondpad, and an inductor core layer over the dielectric. The inductor core layer comprises a magnetic material. At least a portion of the inductor extends within the inductor core layer.

公开(公告)号：US20200066659A1

公开(公告)日：2020-02-27

申请号：US16107791

申请日：2018-08-21

Applicant: Intel Corporation

Inventor： William J. Lambert ,  Omkar Karhade ,  Martin Rodriguez ,  Gregorio R. Murtagian

IPC: H01L23/64 ,  H01L23/522 ,  H01L23/495 ,  H01F27/24 ,  H01L49/02

Abstract: A microelectronics package, comprising a substrate comprising a first bondpad and a second bondpad over a dielectric. An inductor comprising at least one wire extends over the dielectric. The at least one wire has a first end coupled to the first bondpad and a second end coupled to the second bondpad, and an inductor core layer over the dielectric. The inductor core layer comprises a magnetic material. At least a portion of the inductor extends within the inductor core layer.