公开(公告)号：US09766276B2

公开(公告)日：2017-09-19

申请号：US14125462

申请日：2013-06-28

Applicant: INTEL CORPORATION

Inventor： Alexander B. Uan-Zo-Li ,  Xiaoguo Liang ,  Rajiv K. Mongia ,  Matthew D. Coakley

IPC: H02J7/00 ,  G01R21/00 ,  G06F1/28

CPC classification number: G01R21/00 ,  G06F1/28 ,  H02J7/0068

Abstract: A method and system are described herein for detecting a capacity for a power adapter. An example of a method includes detecting an increase in power consumption by a computing device attached to the power adapter. The method can also include detecting a droop in voltage received from the power adapter. Additionally, the method can include storing the current that corresponds with the droop.

公开(公告)号：US09720464B2

公开(公告)日：2017-08-01

申请号：US14580036

申请日：2014-12-22

Applicant: Intel Corporation

Inventor： Jeremy Burr ,  David W. Browning ,  Shawn S. McEuen ,  Mark MacDonald ,  Matthew D. Coakley

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  G06F1/20

CPC classification number: G06F1/203 ,  G06F1/1632 ,  G06F1/206

Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.

公开(公告)号：US10423199B2

公开(公告)日：2019-09-24

申请号：US15665873

申请日：2017-08-01

Applicant: Intel Corporation

Inventor： Jeremy Burr ,  David W. Browning ,  Shawn S. McEuen ,  Mark MacDonald ,  Matthew D. Coakley

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/20

Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.

公开(公告)号：US20150185260A1

公开(公告)日：2015-07-02

申请号：US14125462

申请日：2013-06-28

Applicant: INTEL CORPORATION

Inventor： Alexander B. Uan-Zo-Li ,  Xiaoguo Liang ,  Rajiv K. Mongia ,  Matthew D. Coakley

IPC: G01R21/00

CPC classification number: G01R21/00 ,  G06F1/28 ,  H02J7/0068

Abstract: A method and system are described herein for detecting a capacity for a power adapter. An example of a method includes detecting an increase in power consumption by a computing device attached to the power adapter. The method can also include detecting a droop in voltage received from the power adapter. Additionally, the method can include storing the current that corresponds with the droop.

Abstract translation: 这里描述了用于检测电力适配器的容量的方法和系统。 方法的示例包括检测附接到电源适配器的计算设备的功率消耗的增加。 该方法还可以包括检测从电力适配器接收的电压下降。 另外，该方法可以包括存储与下垂相对应的电流。