公开(公告)号：US20180288868A1

公开(公告)日：2018-10-04

申请号：US15997644

申请日：2018-06-04

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Matthew MANUSHAROW ,  Krishna BHARATH ,  Zhichao ZHANG ,  Yidnekachew S. MEKONNEN ,  Aleksandar ALEKSOV ,  Henning BRAUNISCH ,  Feras EID ,  Javier SOTO

IPC: H05K1/02 ,  H01P3/08 ,  H01P3/02

Abstract: Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.