公开(公告)号：US10569298B2

公开(公告)日：2020-02-25

申请号：US15717582

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Michael Greenley ,  Elah Bozorg-Grayeli

IPC: B05D3/06 ,  C09J163/00 ,  C09J5/04 ,  G02B7/02 ,  C09D163/00 ,  C08G59/18

Abstract: Embodiments herein relate to curing of an epoxy using an ultraviolet (UV) laser. A volume of epoxy may be coupled to an area of a surface, and the volume of epoxy is cured and surrounded by material other than cured epoxy, where the area of the surface is substantially equal to a diameter of the UV laser beam used to cure the epoxy. Other embodiments may be described and/or claimed.

公开(公告)号：US20190091722A1

公开(公告)日：2019-03-28

申请号：US15717582

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Michael Greenley ,  Elah Bozorg-Grayeli

IPC: B05D3/06 ,  C09J163/00 ,  C09J5/04 ,  G02B7/02

Abstract: Embodiments herein relate to curing of an epoxy using an ultraviolet (UV) laser. A volume of epoxy may be coupled to an area of a surface, and the volume of epoxy is cured and surrounded by material other than cured epoxy, where the area of the surface is substantially equal to a diameter of the UV laser beam used to cure the epoxy. Other embodiments may be described and/or claimed.