公开(公告)号：US11417630B2

公开(公告)日：2022-08-16

申请号：US16349543

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Debendra Mallik ,  Digvijay A. Raorane ,  Ravindranath Vithal Mahajan ,  Mitul Bharat Modi

IPC: H01L25/065 ,  H01L21/768 ,  H01L21/822 ,  H01L23/31 ,  H01L23/42 ,  H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L23/498 ,  H01L23/367

Abstract: Semiconductor packages including passive support wafers, and methods of fabricating such semiconductor packages, are described. In an example, a semiconductor package includes a passive support wafer mounted on several active dies. The active dies may be attached to an active die wafer, and the passive support wafer may include a monolithic form to stabilize the active dies and active die wafer during processing and use. Furthermore, the passive support wafer may include a monolith of non-polymeric material to transfer and uniformly distribute heat generated by the active dies.