公开(公告)号：US20250112202A1

公开(公告)日：2025-04-03

申请号：US18374948

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Abdallah BACHA ,  Cindy MUIR ,  Mohan Prashanth JAVARE GOWDA ,  Stephan STOECKL ,  Thomas WAGNER ,  Wolfgang MOLZER

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/367 ,  H01L23/538 ,  H01L25/10 ,  H10B80/00

Abstract: Embodiments herein relate to systems, apparatuses, or processes for packages that include substrates that include one or more die in a cavity within the substrate, where sides and a bottom of the cavity are lined with a heat spreader, or TIM, material that is thermally coupled to a side of the substrate using thermally conductive vias. In embodiments, thermally conductive vias may be thermally coupled with the heat spreader at the side of the substrate. Other embodiments may be described and/or claimed.

公开(公告)号：US20250112139A1

公开(公告)日：2025-04-03

申请号：US18374954

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Abdallah BACHA ,  Thomas WAGNER ,  Cindy MUIR ,  Mohan Prashanth JAVARE GOWDA ,  Stephan STOECKL ,  Wolfgang MOLZER

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538 ,  H01L25/065

Abstract: Embodiments herein relate to systems, apparatuses, or processes for forming a die that has active circuitry within the die and also one or more vias that extend through the die that are electrically isolated from the active circuitry. In embodiments, the active circuitry may be within a region within a die, for example in the center of the die, and the vias may be in an extended area around the active circuitry of the die. In embodiments, an existing die may be provided, and an extended area may be formed on the existing die into which the vias may be placed. Other embodiments may be described and/or claimed.