公开(公告)号：US12207409B2

公开(公告)日：2025-01-21

申请号：US17081502

申请日：2020-10-27

Applicant: Intel Corporation

Inventor： John Hung ,  Andrew Morning-Smith ,  Kai-Uwe Schmidt ,  Nan Allison Yao

IPC: H05K1/18 ,  H05K1/14 ,  G06F1/18

Abstract: An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.

公开(公告)号：US20210120672A1

公开(公告)日：2021-04-22

申请号：US17133836

申请日：2020-12-24

Applicant: Intel Corporation

Inventor： John Hung ,  Andrew Morning-Smith ,  Kai-Uwe Schmidt ,  Paul Gwin ,  Nan Allison Yao

IPC: H05K1/14 ,  H05K7/20 ,  H05K1/02

Abstract: An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.

公开(公告)号：US20210045247A1

公开(公告)日：2021-02-11

申请号：US17081502

申请日：2020-10-27

Applicant: Intel Corporation

Inventor： John Hung ,  Andrew Morning-Smith ,  Kai-Uwe Schmidt ,  Nan Allison Yao

IPC: H05K1/18 ,  H01R12/73

Abstract: An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.