SSD WITH MULTIPLE BANDWIDTH TIERS BASED ON PHYSICAL CHARACTERISTICS

    公开(公告)号:US20220004342A1

    公开(公告)日:2022-01-06

    申请号:US17481796

    申请日:2021-09-22

    Abstract: An embodiment of an electronic apparatus may include a substrate and a controller coupled to the substrate, the controller including circuitry to control access to a NAND-based storage media that includes a plurality of NAND devices located on the substrate and organized into two or more physical clusters with each NAND device uniquely assigned to one of the two or more physical clusters, perform data access to a first physical cluster of the two or more physical clusters at a first bandwidth, and perform data access to a second physical cluster of the two or more physical clusters at a second bandwidth that is slower than the first bandwidth. Other embodiments are disclosed and claimed.

    Gullwing PCB structure to enable high frequency operation

    公开(公告)号:US10405420B2

    公开(公告)日:2019-09-03

    申请号:US16218344

    申请日:2018-12-12

    Abstract: Embodiments include devices and method related to a foldable printed circuit board that may be used in SSD applications. One embodiment relates to a foldable printed circuit board comprising a first rigid portion, a second rigid portion, and a first flexible region coupling the first rigid portion to the second rigid portion. The foldable printed circuit board also includes a third rigid portion and a second flexible region coupling the second rigid portion to the third rigid portion, wherein the first rigid portion and the third rigid portion each have a width that is less than that of the second rigid portion. Other embodiments are described and claimed.

    Positionally aware communication with multiple storage devices over a multi-wire serial bus

    公开(公告)号:US10860521B2

    公开(公告)日:2020-12-08

    申请号:US15395821

    申请日:2016-12-30

    Abstract: Apparatuses, systems, and methods having positionally aware communication between a controller and a plurality of solid state drives (SSD) over a multi-wire serial bus is described. An example electronic device includes a multi-wire serial bus, multiple SSD connectors coupled to the multi-wire serial bus, and a serial bus position address (BPos) line to uniquely identify the physical position of each SSD connector with a unique BPos identifier (ID). The device also includes a serial bus controller coupled to the multi-wire serial bus and further comprising circuitry configured to communicate with a specific SSD connector at a known physical position by associating the BPos ID of the specific SSD connector with the communication.

    PMIC/PMIC interface for distributed memory management implementations

    公开(公告)号:US10936049B2

    公开(公告)日:2021-03-02

    申请号:US16396557

    申请日:2019-04-26

    Abstract: An apparatus is described. The apparatus includes a power management integrated circuit (PMIC) semiconductor chip having logic circuitry to implement a PMIC/PMIC interface having a downstream signal line and an upstream signal line. The downstream signal line to communicate any of multiple states that a downstream PMIC semiconductor chip is to implement with one of multiple voltage levels, where, different ones of the multiple voltage levels correspond to different ones of the multiple states. The upstream signal line is to communicate whether or not the downstream PMIC semiconductor chip is ready to receive a next one of the multiple voltage levels.

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