公开(公告)号：US20220272880A1

公开(公告)日：2022-08-25

申请号：US17741294

申请日：2022-05-10

Applicant: Intel Corporation

Inventor： Shailendra Singh CHAUHAN ,  Raghavendra RAO ,  Ranjul BALAKRISHNAN ,  Nizamuddin SHAIK ,  Bijendra SINGH ,  Siva Prasad JANGILI GANGA ,  Dong-Ho HAN

IPC: H05K9/00 ,  H01R12/71 ,  H01L23/32 ,  H01L23/498 ,  H01L23/552 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

Abstract: A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.