公开(公告)号：US20200312736A1

公开(公告)日：2020-10-01

申请号：US16368049

申请日：2019-03-28

Applicant: Intel Corporation

Inventor： Bijendra SINGH ,  Vikas RAO ,  Sandesh Geejagaaru KRISHNAMURTHY ,  Navneet Kumar SINGH ,  Unnikrishnan Gopinanthan PILLAI

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/48

Abstract: Embodiments disclosed herein include electronic packages with improved thermal performance. In an embodiment, the electronic package comprises a first package substrate, a first die stack over the first package substrate, and a heat spreader over the first die stack. In an embodiment, the heat spreader comprises arms that extend out past sidewalls of the first package substrate. In an embodiment, the electronic package further comprises an interposer over and around the heat spreader, where the interposer is electrically coupled to the first package substrate by a plurality of interconnects. In an embodiment, the electronic package further comprises a second package substrate over the interposer, and a second die over the second package substrate.

公开(公告)号：US20220272880A1

公开(公告)日：2022-08-25

申请号：US17741294

申请日：2022-05-10

Applicant: Intel Corporation

Inventor： Shailendra Singh CHAUHAN ,  Raghavendra RAO ,  Ranjul BALAKRISHNAN ,  Nizamuddin SHAIK ,  Bijendra SINGH ,  Siva Prasad JANGILI GANGA ,  Dong-Ho HAN

IPC: H05K9/00 ,  H01R12/71 ,  H01L23/32 ,  H01L23/498 ,  H01L23/552 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

Abstract: A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.

公开(公告)号：US20230006375A1

公开(公告)日：2023-01-05

申请号：US17902503

申请日：2022-09-02

Applicant: Intel Corporation

Inventor： Shailendra Singh CHAUHAN ,  Bijendra SINGH ,  Siva Prasad JANGILI GANGA ,  Santhosh AP ,  Ranjul BALAKRISHNAN

IPC: H01R12/71 ,  H01R12/52 ,  H01R13/24

Abstract: Embodiments of connector-less modules and associated platforms employing the module. The module employs a Land Grid Array (LGA) comprising an array of LGA pins on the underside of the module PCB that are configured to engage respective pads patterned on a motherboard or system board PCB by applying a downward force to the module PCB. A novel clip assembly is provided to apply the downward force, while also aligning the module PCB (and its LGA) to the motherboard or system board PCB. A heat shield is provided that is configured to be disposed over the module PCB to facilitate enhanced thermal spreading and lowering thermal resistance both towards the heat shield and the PCBs. Example modules include a WWAN module and an NVMe SSD module. The module PCB may employ an M.2 form factor or other form factors.