公开(公告)号：US20250079262A1

公开(公告)日：2025-03-06

申请号：US18952626

申请日：2024-11-19

Applicant: Intel Corporation

Inventor： Sami Mohammed Alelyani ,  Paul Jonathan Diglio ,  Gregorio Roberto Murtagian ,  Shengquan Ou ,  Joseph Blane Petrini

IPC: H01L23/433 ,  H01L23/427

Abstract: Systems, apparatus, articles of manufacture, and methods for temperature control of jet impingement cooling of integrated circuit packages are disclosed. An example system includes: a first nozzle to direct a first portion of impingement fluid towards an integrated circuit package; a second nozzle to direct a second portion of the impingement fluid towards the integrated circuit package; a first flow restrictor to control a first pressure of the first portion of the impingement fluid provided to the first nozzle; and a second flow restrictor to control a second pressure of the second portion of the impingement fluid provided to the second nozzle.

公开(公告)号：US20240328512A1

公开(公告)日：2024-10-03

申请号：US18192429

申请日：2023-03-29

Applicant: Intel Corporation

Inventor： Craig Yost ,  Paul Jonathan Diglio ,  Ruben Eduardo Nunez Blanco

IPC: F16J15/06 ,  H05K7/20

CPC classification number: F16J15/06 ,  H05K7/20009

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed that reduce leakage of a cooling fluid used to cool an electronic component. An example disclosed herein includes a seal assembly comprising a socket to receive an electronic component, the electronic component including a semiconductor die and a substrate to support the die, a first seal to be forced against the electronic component, the first seal to surround the die, and a second seal to be forced against the electronic component, the second seal to surround the first seal.