公开(公告)号：US20250014967A1

公开(公告)日：2025-01-09

申请号：US18893576

申请日：2024-09-23

Applicant: Intel Corporation

Inventor： Kyle Jordan Arrington ,  Prabhakar Subrahmanyam ,  Steven Adam Klein ,  Kelly Porter Lofgreen ,  Joseph Blane Petrini

IPC: H01L23/473 ,  H01L23/40 ,  H01L23/42 ,  H01R12/85 ,  H01R13/52

Abstract: Systems, apparatus, articles of manufacture, and methods to improve thermal dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes: a socket to receive an integrated circuit package; and a plate to apply a load on the integrated circuit package towards the socket. The plate includes an internal channel to carry a coolant through the plate. The liquid coolant is to facilitate cooling of the integrated circuit package.

公开(公告)号：US20250079262A1

公开(公告)日：2025-03-06

申请号：US18952626

申请日：2024-11-19

Applicant: Intel Corporation

Inventor： Sami Mohammed Alelyani ,  Paul Jonathan Diglio ,  Gregorio Roberto Murtagian ,  Shengquan Ou ,  Joseph Blane Petrini

IPC: H01L23/433 ,  H01L23/427

Abstract: Systems, apparatus, articles of manufacture, and methods for temperature control of jet impingement cooling of integrated circuit packages are disclosed. An example system includes: a first nozzle to direct a first portion of impingement fluid towards an integrated circuit package; a second nozzle to direct a second portion of the impingement fluid towards the integrated circuit package; a first flow restrictor to control a first pressure of the first portion of the impingement fluid provided to the first nozzle; and a second flow restrictor to control a second pressure of the second portion of the impingement fluid provided to the second nozzle.