公开(公告)号：US12000487B2

公开(公告)日：2024-06-04

申请号：US17895104

申请日：2022-08-25

Applicant: Intel Corporation

Inventor： Paul Diglio ,  Craig Yost ,  Christopher Wade Ackerman

IPC: F16J15/328

CPC classification number: F16J15/328

Abstract: The present disclosure is directed to a system having a first loading component and a second loading component for applying load to a device during a test of the device, the first loading component is configured to be moveable with respect to the second loading component. The system includes a seal member arranged between the first loading component and the second loading component, the seal member is adapted to engage the device during testing so as to apply a load against the device during testing and provide sealing around a cavity positioned below the first loading component and above the device.

公开(公告)号：US20240328512A1

公开(公告)日：2024-10-03

申请号：US18192429

申请日：2023-03-29

Applicant: Intel Corporation

Inventor： Craig Yost ,  Paul Jonathan Diglio ,  Ruben Eduardo Nunez Blanco

IPC: F16J15/06 ,  H05K7/20

CPC classification number: F16J15/06 ,  H05K7/20009

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed that reduce leakage of a cooling fluid used to cool an electronic component. An example disclosed herein includes a seal assembly comprising a socket to receive an electronic component, the electronic component including a semiconductor die and a substrate to support the die, a first seal to be forced against the electronic component, the first seal to surround the die, and a second seal to be forced against the electronic component, the second seal to surround the first seal.