公开(公告)号：US20250008661A1

公开(公告)日：2025-01-02

申请号：US18343993

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Arturo Navarro Alvarez ,  Jeff Ku ,  Luis Carlos Sanchez Herrera ,  Min Suet Lim ,  Pin Wang ,  Tongyan Zhai ,  Raghavendra Ramesh Rao

IPC: H05K1/18

Abstract: Deflection spring compression mounting is disclosed. A disclosed example deflection spring for an electronics package includes first and second end portions having first and second locking interfaces, respectively, to at least partially constrain the first and second end portions relative to a support, a curved portion, and a medial portion having a third locking interface to fix the medial portion relative to the support, wherein fixing the medial portion relative to the support causes the curved portion to contact and press against the electronics package.