公开(公告)号：US20170287803A1

公开(公告)日：2017-10-05

申请号：US15089332

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Prakriti CHOUDHARY ,  Arnab CHOUDHURY

IPC: H01L23/34 ,  H05B6/10 ,  H01L23/367 ,  H05B6/06

Abstract: Embodiments are generally directed to extended temperature operation for electronic systems using induction heating. An embodiment of an apparatus includes an electronic device including: a die or package; a thermal solution coupled with the die or package for cooling of the die or package; and ferromagnetic material, wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field.