公开(公告)号：US20190043772A1

公开(公告)日：2019-02-07

申请号：US16075120

申请日：2016-04-02

Applicant: Intel Corporation

Inventor： Purushotham Kaushik MUTHUR SRINATH ,  Pramod MALATKAR ,  Sairam AGRAHARAM ,  Chandra M. JHA ,  Arnab CHOUDHURY ,  Nachiket R. RARAVIKAR

IPC: H01L23/26 ,  H01L23/433

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a thermal solution for 3D packaging. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces therein; a first layer functional silicon die electrically interfaced to the electrical traces of the substrate layer, the first layer functional silicon die having a first thermal pad integrated thereupon; a second layer functional silicon die positioned above the first layer functional silicon die, the second layer functional silicon die having a second thermal pad integrated thereupon; and a conductivity layer positioned between the first layer functional silicon die and the second layer functional silicon die, wherein the conductivity layer is to: (i) electrically join the second layer functional silicon die to the first layer functional silicon die and (ii) bond the first thermal pad of the first layer functional silicon die to the second thermal pad of the second layer functional silicon die via solder. Other related embodiments are disclosed.

公开(公告)号：US20170287803A1

公开(公告)日：2017-10-05

申请号：US15089332

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Prakriti CHOUDHARY ,  Arnab CHOUDHURY

IPC: H01L23/34 ,  H05B6/10 ,  H01L23/367 ,  H05B6/06

Abstract: Embodiments are generally directed to extended temperature operation for electronic systems using induction heating. An embodiment of an apparatus includes an electronic device including: a die or package; a thermal solution coupled with the die or package for cooling of the die or package; and ferromagnetic material, wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field.