公开(公告)号：US20200033401A1

公开(公告)日：2020-01-30

申请号：US16045242

申请日：2018-07-25

Applicant: Intel Corporation

Inventor： Ramaswamy PARTHASARATHY ,  Vikas RAO ,  Praveen PAI

IPC: G01R31/28 ,  G01K11/12 ,  H05K7/20 ,  H05K1/02

Abstract: Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.