公开(公告)号：US20210074866A1

公开(公告)日：2021-03-11

申请号：US16562889

申请日：2019-09-06

Applicant: Intel Corporation

Inventor： Priyanka DOBRIYAL ,  Ankur AGRAWAL ,  Susheel JADHAV ,  Quan TRAN ,  Raghuram NARAYAN ,  Raiyomand ASPANDIAR ,  Kenneth BROWN ,  John HECK

IPC: H01L31/0232 ,  G02B3/00 ,  H01L31/0216 ,  H01L31/02 ,  H01L25/16 ,  H01L23/538 ,  H01L31/18 ,  G02B1/11 ,  G02B6/42

Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.