公开(公告)号：US20190333861A1

公开(公告)日：2019-10-31

申请号：US16474019

申请日：2017-03-29

Applicant: Intel Corporation

Inventor： Srinivas V. Pietambaram ,  Rahul N. Manapalli ,  Praneeth Akkinepally ,  Jesse C. Jones ,  Yosuke Kanaoka ,  Dilan Seneviratne

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065

Abstract: Described are microelectronic devices including an embedded die substrate including a molded component formed on or over a surface of a laminated substrate that provides a planar outer surface independent of the contour of the adjacent laminated substrate surface. The molded component may be formed over at least a portion of the embedded die. In other examples, the molded component and resulting planar outer surface may alternatively be on the backside of the substrate, away from the embedded die. The molded component may include an epoxy mold compound; and may be formed through processes including compression molding and transfer molding.