公开(公告)号：US20240123561A1

公开(公告)日：2024-04-18

申请号：US17966021

申请日：2022-10-14

Applicant: Intel Corporation

Inventor： Yosef KORNBLUTH ,  Whitney BRYKS ,  Ravindranadh Tagore ELURI

IPC: B24B1/00 ,  B24B37/04 ,  B24B57/02

CPC classification number: B24B1/005 ,  B24B37/042 ,  B24B57/02

Abstract: This disclosure describes systems, methods, and devices related to enhanced plate polishing. A device may place a liquid between a plate and a wafer. The device may utilize a controller to vary a current flowing through an array of coils. The device may apply pressure on the plate to press against the liquid and the wafer.