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公开(公告)号：US20190129095A1
公开(公告)日：2019-05-02
申请号：US16216976
申请日：2018-12-11
Applicant: Intel Corporation
Inventor： Kimchau Nhu Nguyen , George A. Ghiurcan , Yoel Chetrit , Jeffrey B. Driscoll , Richard Jones , Harel Frish , Reece A. Defrees , Wenhua Lin , Jung S. Park
Abstract: Embodiments may relate to a silicon photonic chip, and particularly a back absorber within the silicon photonic chip. The back absorber may include a substrate material with a slab portion that includes a doped portion of the substrate material. The back absorber may be positioned at the backside of a laser that is configured to project light along a waveguide of the silicon photonic chip. Other embodiments may be described or claimed.
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