公开(公告)号：US20190129095A1

公开(公告)日：2019-05-02

申请号：US16216976

申请日：2018-12-11

申请人： Intel Corporation

发明人： Kimchau Nhu Nguyen ,  George A. Ghiurcan ,  Yoel Chetrit ,  Jeffrey B. Driscoll ,  Richard Jones ,  Harel Frish ,  Reece A. Defrees ,  Wenhua Lin ,  Jung S. Park

IPC分类号： G02B6/122 ,  G02B6/24 ,  H01S5/026

摘要： Embodiments may relate to a silicon photonic chip, and particularly a back absorber within the silicon photonic chip. The back absorber may include a substrate material with a slab portion that includes a doped portion of the substrate material. The back absorber may be positioned at the backside of a laser that is configured to project light along a waveguide of the silicon photonic chip. Other embodiments may be described or claimed.

公开(公告)号：US11217964B2

公开(公告)日：2022-01-04

申请号：US16236211

申请日：2018-12-28

申请人： Intel Corporation

发明人： Pierre Doussiere ,  George A. Ghiurcan ,  Jonathan K. Doylend ,  Harel Frish

IPC分类号： H01S5/02 ,  H01S5/065 ,  H04J14/02 ,  H04B10/25 ,  H01S5/40 ,  G02B6/122 ,  H01S5/0683 ,  H04B10/50 ,  G02B6/42 ,  G02B6/12

摘要： There is disclosed in one example a fiberoptic communication device, including: a modulator to modulate data onto a laser pulse; and a semiconductor laser source including an active optical waveguide to provide optical gain and support an optical mode, the laser source further including a V-shaped current channel superimposed on the optical waveguide, and disposed to feed the active optical waveguide with electrical current along its length, the current channel having a proximate end to the optical mode, the proximate end having a width substantially matching a diameter of the optical mode, and a removed end from the optical mode, wherein the removed end is substantially wider than the proximate end.

公开(公告)号：US10996408B2

公开(公告)日：2021-05-04

申请号：US16517159

申请日：2019-07-19

申请人： Intel Corporation

发明人： John Heck ,  Harel Frish ,  Reece DeFrees ,  George A. Ghiurcan ,  Hari Mahalingam ,  Pegah Seddighian

IPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/122

摘要： Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.

公开(公告)号：US20190339466A1

公开(公告)日：2019-11-07

申请号：US16517159

申请日：2019-07-19

申请人： Intel Corporation

发明人： John Heck ,  Harel Frish ,  Reece DeFrees ,  George A. Ghiurcan ,  Hari Mahalingam ,  Pegah Seddighian

IPC分类号： G02B6/42

摘要： Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.