公开(公告)号：US20180003764A1

公开(公告)日：2018-01-04

申请号：US15200997

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Sankaran M. Menon ,  Rehan M. Sheikh ,  Rolf H. Kuehnis ,  John Michael Peterson ,  Asifur Rahman ,  Abram M. Detofsky ,  Mohsen Fazlian

IPC: G01R31/28 ,  H04B1/40 ,  H04W4/00 ,  H04W88/06

CPC classification number: G01R31/2834 ,  H04B1/40 ,  H04W4/80 ,  H04W24/06 ,  H04W88/06

Abstract: The disclosed systems, devices, and methods may provide for wireless testing of devices and, in particular, wireless testing of semiconductor devices comprising integrated circuits, memory, and logic circuitry that can be present on a wafer. The semiconductor devices can be tested for functional defects by applying one or more test patterns to the semiconductor devices. Further, for devices under test that do not have built-in wireless connectivity (for example, those that do not have a built-in Bluetooth low-energy engine), the disclosure describes systems and methods that the devices under test can use for external wireless connectivity (e.g., an external board having Bluetooth low-energy) on the low-bandwidth interface. In one example embodiment, for high-bandwidth scan testing, wireless connectivity modules (such as those implementing WiFi or WiGig) are described, which can be used to meet the bandwidth requirements of the one or more tests.

公开(公告)号：US10247773B2

公开(公告)日：2019-04-02

申请号：US15200997

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Sankaran M. Menon ,  Rehan M. Sheikh ,  Rolf H. Kuehnis ,  John Michael Peterson ,  Asifur Rahman ,  Abram M. Detofsky ,  Mohsen Fazlian

IPC: G01R31/28 ,  H04B1/40 ,  H04W4/00 ,  H04W88/06 ,  H04W4/80 ,  H04W24/06

Abstract: The disclosed systems, devices, and methods may provide for wireless testing of devices and, in particular, wireless testing of semiconductor devices comprising integrated circuits, memory, and logic circuitry that can be present on a wafer. The semiconductor devices can be tested for functional defects by applying one or more test patterns to the semiconductor devices. Further, for devices under test that do not have built-in wireless connectivity (for example, those that do not have a built-in Bluetooth low-energy engine), the disclosure describes systems and methods that the devices under test can use for external wireless connectivity (e.g., an external board having Bluetooth low-energy) on the low-bandwidth interface. In one example embodiment, for high-bandwidth scan testing, wireless connectivity modules (such as those implementing WiFi or WiGig) are described, which can be used to meet the bandwidth requirements of the one or more tests.