公开(公告)号：US10324213B2

公开(公告)日：2019-06-18

申请号：US15387183

申请日：2016-12-21

Applicant: Intel Corporation

Inventor： Marcie M. Miller ,  Roderick E. Kronschnabel ,  Matthew J. Schneider ,  Rene J. Sanchez ,  Christopher L. Ross ,  Ryan R. Carnaghi ,  Keith A. Swesey ,  Kevin Edwards ,  Steven W. Whitehorn ,  Cecilia Yancy ,  Thomas V. Moss

IPC: G01R27/26 ,  G01V3/08

Abstract: A capacitive proximity sensor may include a proximity sensing capacitor to provide a voltage output based on a voltage input, the capacitor including a ground plane and an electrode loop capacitively coupled to the ground plane. The proximity sensor may include a processor to detect an object proximity based on a change in the voltage output. This proximity sensor provides automated detection of a person, and thereby reduces the need for a vehicle occupant or child caregiver to activate a sensor by pressing a button. The use of a capacitance-based proximity sensor reduces issues associated with fabric, clothing, or other materials separating the proximity sensor from a person.

公开(公告)号：US11112521B2

公开(公告)日：2021-09-07

申请号：US16444026

申请日：2019-06-18

Applicant: Intel Corporation

Inventor： Marcie M. Miller ,  Roderick E. Kronschnabel ,  Matthew J. Schneider ,  Rene J. Sanchez ,  Christopher L. Ross ,  Ryan R. Carnaghi ,  Keith A. Swesey ,  Kevin Edwards ,  Steven W. Whitehorn ,  Cecilia Yancy ,  Thomas V. Moss

IPC: G01R27/26 ,  G01V3/08

Abstract: A capacitive proximity sensor may include a proximity sensing capacitor to provide a voltage output based on a voltage input, the capacitor including a ground plane and an electrode loop capacitively coupled to the ground plane. The proximity sensor may include a processor to detect an object proximity based on a change in the voltage output. This proximity sensor provides automated detection of a person, and thereby reduces the need for a vehicle occupant or child caregiver to activate a sensor by pressing a button. The use of a capacitance-based proximity sensor reduces issues associated with fabric, clothing, or other materials separating the proximity sensor from a person.

公开(公告)号：US10228418B2

公开(公告)日：2019-03-12

申请号：US15126988

申请日：2014-04-21

Applicant: INTEL CORPORATION

Inventor： Sruti Chigullapalli ,  Rene J. Sanchez ,  Nader N. Abazarnia ,  Todd R. Coons ,  Tuan Hoong Goh

IPC: G01R31/28 ,  G01R1/04

Abstract: Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.