公开(公告)号：US10930575B2

公开(公告)日：2021-02-23

申请号：US16337883

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Tong W. Chao ,  Stephanie L. Seaman ,  Ridvan A. Sahan ,  Ying-Feng Pang

IPC: H01L23/36 ,  H05K7/20 ,  H01L23/427 ,  H01L23/467

Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.