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    Thermal control for processor-based devices
    2.
    发明授权
    Thermal control for processor-based devices 有权

    公开(公告)号：US11917790B2

    公开(公告)日：2024-02-27

    申请号：US16859202

    申请日：2020-04-27

    申请人： Intel Corporation

    发明人： Prabhakar Subrahmanyam ,  Casey Winkel ,  Yingqiong Bu ,  Ming Zhang ,  Yuehong Fan ,  Yi Xia ,  Ying-Feng Pang

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20154 ,  H05K7/209 ,  H05K7/20209 ,  H05K7/20927

    摘要： The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

    Reconfigurable cooling assembly for integrated circuitry
    3.
    发明授权
    Reconfigurable cooling assembly for integrated circuitry 有权

    公开(公告)号：US10930575B2

    公开(公告)日：2021-02-23

    申请号：US16337883

    申请日：2016-09-30

    申请人： Intel Corporation

    发明人： Prabhakar Subrahmanyam ,  Tong W. Chao ,  Stephanie L. Seaman ,  Ridvan A. Sahan ,  Ying-Feng Pang

    IPC分类号： H01L23/36 ,  H05K7/20 ,  H01L23/427 ,  H01L23/467

    摘要： Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.