公开(公告)号：US20240103073A1

公开(公告)日：2024-03-28

申请号：US17952031

申请日：2022-09-23

Applicant: Intel Corporation

Inventor： Patrick PARDY ,  Robert WADELL ,  Tewodros WONDIMU ,  Michael APODACA ,  Joshua FREIER ,  Amir RAVEH ,  Eric BRUMMER

IPC: G01R31/307 ,  H01L23/467

CPC classification number: G01R31/307 ,  H01L23/467

Abstract: Embodiments described herein may be related to apparatuses, processes, systems, and/or techniques for an enclosure, which may be referred to as a cartridge, that surrounds a semiconductor device prior to the semiconductor device being bombarded with an electron beam during operational testing. In embodiments, the enclosure may include a cooling plate that includes a thermal cooling mechanism that is thermally coupled with the semiconductor device to control the temperature of the semiconductor device during testing. The thermal cooling mechanism may include a manifold that extends through the plate through which a cooled fluid, cooled air, or some other cool material may be circulated to cool the semiconductor device. Other embodiments may be described and/or claimed.