公开(公告)号：US20240178151A1

公开(公告)日：2024-05-30

申请号：US18071901

申请日：2022-11-30

Applicant: Intel Corporation

Inventor： Minglu LIU ,  Alexander AGUINAGA ,  Gang DUAN ,  Jung Kyu HAN ,  Yosuke KANAOKA ,  Yi LI ,  Robin MCREE ,  Hong Seung YEON

IPC: H01L23/544 ,  H01L23/15 ,  H01L23/498

CPC classification number: H01L23/544 ,  H01L23/15 ,  H01L23/49816

Abstract: Embodiments disclosed herein include a package architecture. In an embodiment, the package architecture comprises a first substrate with a first fiducial mark on a surface of the first substrate. In an embodiment, the package architecture further comprises a second substrate over the first substrate, where the second substrate comprises glass and a second fiducial mark on the second substrate, and where a footprint of the second fiducial mark at least partially overlaps a footprint of the first fiducial mark.