公开(公告)号：US11411163B2

公开(公告)日：2022-08-09

申请号：US16465547

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Gerrit J. Vreman ,  Mohamed A. Abdelmoneum ,  Satoshi Suzuki

IPC: H01L41/047 ,  H01L41/09 ,  H01L41/053 ,  B06B1/06 ,  H01L41/18 ,  H01L41/25 ,  H01L41/338

Abstract: Aspects of the embodiments are directed to systems and devices that include a piezo-electric element comprising a top-side electrode and a bottom-side electrode; a metal contact pad electrically connected to the bottom-side electrode; an electrode electrically connected to the top-side electrode; and an encasement encasing the piezo-electric element. The piezo-electric element can be prepared to include steps and metallization for use in one or more types of packaging.

公开(公告)号：US20220108092A1

公开(公告)日：2022-04-07

申请号：US17553092

申请日：2021-12-16

Applicant: Intel Corporation

Inventor： Chieh-Yih Wan ,  Eduardo Alban ,  Satoshi Suzuki ,  Robert Flory ,  Alex Nguyen ,  Rahul C. Shah ,  Cagri Tanriover

IPC: G06K7/10 ,  G06K19/07

Abstract: The present disclosure relates to a mobile agent in an RFID system with reduced power consumption and increased localization capabilities. In one aspect, a relay circuit attached to a mobility mechanism such as a drone or robot is in communication with an RFID reader and a backend host computer. The mobile agent moves around a warehouse, for instance, in which landmark RFID tags are arranged. The mobile agent can transmit with an adjustable power to identify a single landmark tag and associate it with object tags of one or more objects within the range of the mobile agent. The host computer can communicate with the mobile agent to instruct it to adjust its power when multiple landmark tags are detected.

公开(公告)号：US20200020843A1

公开(公告)日：2020-01-16

申请号：US16465547

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Gerrit J. Vreman ,  Mohamed A. Abdelmoneum ,  Satoshi Suzuki

IPC: H01L41/047 ,  B06B1/06 ,  H01L41/18 ,  H01L41/053 ,  H01L41/09 ,  H01L41/25 ,  H01L41/338

Abstract: Aspects of the embodiments are directed to systems and devices that include a piezo-electric element comprising a top-side electrode and a bottom-side electrode; a metal contact pad electrically connected to the bottom-side electrode; an electrode electrically connected to the top-side electrode; and an encasement encasing the piezo-electric element. The piezo-electric element can be prepared to include steps and metallization for use in one or more types of packaging.