公开(公告)号：US20230204819A1

公开(公告)日：2023-06-29

申请号：US17561366

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Khaled Ahmed ,  Pooya Tadayon ,  Joshua B. Fryman ,  Sergey Yuryevich Shumarayev

IPC: G02B1/00 ,  H01L25/16 ,  H04B10/50

CPC classification number: G02B1/002 ,  H01L25/167 ,  H04B10/502 ,  G02B5/04

Abstract: Technologies for chip-to-chip optical data transfer are disclosed. In the illustrative embodiment, microLEDs on a first chip are used to send data to microphotodiodes on a second chip. The beams from the microLEDs may be sent to the microphotodiodes using an optical bridge, microprisms, a channel through a substrate, a channel defined in a substrate, etc. The microLEDs may be used for high-speed data transfer with low power usage. A chip may include a relatively large number of microLEDs and/or microphotodiodes, allowing for a large bandwidth connection. MicroLEDs and microphotodiodes may be used to connect different parts of the same chip, different chips on the same package, different packages on the same device, or different chips on different devices.

公开(公告)号：US20230097800A1

公开(公告)日：2023-03-30

申请号：US17485358

申请日：2021-09-25

Applicant: Intel Corporation

Inventor： Joshua Bruce Fryman ,  Khaled Ahmed ,  James E. Jaussi ,  Sergey Yuryevich Shumarayev

IPC: H04B10/50 ,  H04B10/80 ,  H01L33/48 ,  H01L33/58

Abstract: An apparatus comprising a chip comprising a plurality of micro-emitters, the micro-emitters to couple to a plurality of data lines and to an optical fiber, wherein the micro-emitters are to generate optical signals for parallel transmission through the optical fiber, the optical signals corresponding to data communicated on the data lines.