公开(公告)号：US10770443B2

公开(公告)日：2020-09-08

申请号：US16146716

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Karthik Chandrasekar ,  Shreepad Panth ,  Ravi Prakash Gutala

IPC: H01L25/18 ,  H01L23/00 ,  H03L7/081 ,  H03K19/17796 ,  H01L23/538

Abstract: An integrated circuit device that may include programmable logic fabric disposed on an integrated circuit die and a base die that may include clocking circuitry. Synchronization between logic resources in the programmable logic fabric may be performed using clock signals received from the clocking circuitry. The clocking circuitry in the base die may include phase-locked loops, delay-locked loops, clock trees, and other similar circuitry.

公开(公告)号：US20200105732A1

公开(公告)日：2020-04-02

申请号：US16146716

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Karthik Chandrasekar ,  Shreepad Panth ,  Ravi Prakash Gutala

IPC: H01L25/18 ,  H01L23/00 ,  H03L7/081 ,  H03K19/177 ,  H01L23/538

Abstract: An integrated circuit device that may include programmable logic fabric disposed on an integrated circuit die and a base die that may include clocking circuitry. Synchronization between logic resources in the programmable logic fabric may be performed using clock signals received from the clocking circuitry. The clocking circuitry in the base die may include phase-locked loops, delay-locked loops, clock trees, and other similar circuitry.