公开(公告)号：US11294852B2

公开(公告)日：2022-04-05

申请号：US16917888

申请日：2020-06-30

申请人： Intel Corporation

发明人： Nevine Nassif ,  Yen-Cheng Liu ,  Krishnakanth V. Sistla ,  Gerald Pasdast ,  Siva Soumya Eachempati ,  Tejpal Singh ,  Ankush Varma ,  Mahesh K. Kumashikar ,  Srikanth Nimmagadda ,  Carleton L. Molnar ,  Vedaraman Geetha ,  Jeffrey D. Chamberlain ,  William R. Halleck ,  George Z. Chrysos ,  John R. Ayers ,  Dheeraj R. Subbareddy

IPC分类号： G06F1/04 ,  G06F15/78 ,  G06F1/10 ,  G06F15/167 ,  G06F9/38 ,  G06F9/50 ,  G06F15/173

摘要： Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.

公开(公告)号：US10795853B2

公开(公告)日：2020-10-06

申请号：US15721822

申请日：2017-09-30

申请人： Intel Corporation

发明人： Nevine Nassif ,  Yen-Cheng Liu ,  Krishnakanth V. Sistla ,  Gerald Pasdast ,  Siva Soumya Eachempati ,  Tejpal Singh ,  Ankush Varma ,  Mahesh K. Kumashikar ,  Srikanth Nimmagadda ,  Carleton L. Molnar ,  Vedaraman Geetha ,  Jeffrey D. Chamberlain ,  William R. Halleck ,  George Z. Chrysos ,  John R. Ayers ,  Dheeraj R. Subbareddy

IPC分类号： G06F1/04 ,  G06F1/12 ,  G06F5/06 ,  G06F15/78 ,  G06F1/10 ,  G06F15/167 ,  G06F9/38 ,  G06F9/50 ,  G06F15/173

摘要： Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.

公开(公告)号：US11586579B2

公开(公告)日：2023-02-21

申请号：US17513795

申请日：2021-10-28

申请人： Intel Corporation

发明人： Nevine Nassif ,  Yen-Cheng Liu ,  Krishnakanth V. Sistla ,  Gerald Pasdast ,  Siva Soumya Eachempati ,  Tejpal Singh ,  Ankush Varma ,  Mahesh K. Kumashikar ,  Srikanth Nimmagadda ,  Carleton L. Molnar ,  Vedaraman Geetha ,  Jeffrey D. Chamberlain ,  William R. Halleck ,  George Z. Chrysos ,  John R. Ayers ,  Dheeraj R. Subbareddy

IPC分类号： G06F1/04 ,  G06F1/12 ,  G06F15/78 ,  G06F1/10 ,  G06F15/167 ,  G06F9/38 ,  G06F9/50 ,  G06F15/173

摘要： Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.

公开(公告)号：US11899615B2

公开(公告)日：2024-02-13

申请号：US18102568

申请日：2023-01-27

申请人： Intel Corporation

发明人： Nevine Nassif ,  Yen-Cheng Liu ,  Krishnakanth V. Sistla ,  Gerald Pasdast ,  Siva Soumya Eachempati ,  Tejpal Singh ,  Ankush Varma ,  Mahesh K. Kumashikar ,  Srikanth Nimmagadda ,  Carleton L. Molnar ,  Vedaraman Geetha ,  Jeffrey D. Chamberlain ,  William R. Halleck ,  George Z Chrysos ,  John R. Ayers ,  Dheeraj R. Subbareddy

IPC分类号： G06F1/00 ,  G06F15/78 ,  G06F1/10 ,  G06F15/167 ,  G06F1/04 ,  G06F1/12 ,  G06F9/38 ,  G06F9/50 ,  G06F15/173

CPC分类号： G06F15/7889 ,  G06F1/04 ,  G06F1/10 ,  G06F1/12 ,  G06F9/3869 ,  G06F9/5038 ,  G06F15/167 ,  G06F15/17312

摘要： Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.