公开(公告)号：US20240422899A1

公开(公告)日：2024-12-19

申请号：US18335145

申请日：2023-06-15

Applicant: Intel Corporation

Inventor： Srinivas B REDDY ,  Jayprakash THAKUR ,  Arvind S ,  Rajasekar A ,  Bindu Prabhakar RAO ,  Pali BARMATE

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/46

Abstract: The present disclosure generally relates to a multi-layer printed circuit board. The multi-layer printed circuit board may include a core layer and a first prepreg layer adjacent the core layer. The core layer may include a first biodegradable material sandwiched between two electrically conducting layers. A method for forming a multi-layer printed circuit board is also provided herein.