公开(公告)号：US20200279069A1

公开(公告)日：2020-09-03

申请号：US16649588

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Ranjith KUMAR ,  Mark T. BOHR ,  Ruth A. BRAIN ,  Marni NABORS ,  Tai-Hsuan WU ,  Sourav CHAKRAVARTY

IPC: G06F30/3953 ,  H01L23/50 ,  H01L23/522

Abstract: An integrated circuit structure includes a metal level comprising a plurality of interconnect lines along a first direction. A cell is on the metal level, wherein one or more of the plurality of interconnect lines that extend through the cell comprise a power shared track that is segmented inside the cell into one or more power segments and one or more signal segments so that both power and signals share a same track.