公开(公告)号：US20240178157A1

公开(公告)日：2024-05-30

申请号：US18071257

申请日：2022-11-29

Applicant: Intel Corporation

Inventor： Vinith BEJUGAM ,  Whitney BRYKS ,  Brandon C. MARIN ,  Vishal Bhimrao ZADE ,  Deniz TURAN ,  Srinivas V. PIETAMBARAM

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/49822

Abstract: Embodiments disclosed herein include package substrates. In a particular embodiment, the package substrate comprises a core. The core may be a glass core. In an embodiment, buildup layers are provided over the core, and a shape memory polymer (SMP) is provided over the core.