公开(公告)号：US20220139896A1

公开(公告)日：2022-05-05

申请号：US17574485

申请日：2022-01-12

Applicant: Intel Corporation

Inventor： Wilfred GOMES ,  Mark T. BOHR ,  Rajesh KUMAR ,  Robert L. SANKMAN ,  Ravindranath V. MAHAJAN ,  Wesley D. MC CULLOUGH

IPC: H01L25/18 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16 ,  H01L23/522 ,  H01L23/48 ,  H01L23/538 ,  H01L23/498

Abstract: The present disclosure is directed to systems and methods of conductively coupling a plurality of relatively physically small core dies to a relatively physically larger base die using an electrical mesh network that is formed in whole or in part in, on, across, or about all or a portion of the base die. Electrical mesh networks beneficially permit the positioning of the cores in close proximity to support circuitry carried by the base die. The minimal separation between the core circuitry and the support circuitry advantageously improves communication bandwidth while reducing power consumption. Each of the cores may include functionally dedicated circuitry such as processor core circuitry, field programmable logic, memory, or graphics processing circuitry. The use of core dies beneficially and advantageously permits the use of a wide variety of cores, each having a common or similar interface to the electrical mesh network.

公开(公告)号：US20210375825A1

公开(公告)日：2021-12-02

申请号：US17398831

申请日：2021-08-10

Applicant: Intel Corporation

Inventor： Wilfred GOMES ,  Mark T. BOHR ,  Udi SHEREL ,  Leonard M. NEIBERG ,  Nevine NASSIF ,  Wesley D. MC CULLOUGH

IPC: H01L25/065 ,  H01L25/18 ,  H01L25/00

Abstract: Systems and methods of providing redundant functionality in a semiconductor die and package are provided. A three-dimensional electrical mesh network conductively couples smaller semiconductor dies, each including circuitry to provide a first functionality, to a larger base die that includes circuitry to provide a redundant first functionality to the semiconductor die circuitry. The semiconductor die circuitry and the base die circuitry selectively conductively couple to a common conductive structure such that either the semiconductor die circuitry or the base die circuitry is able to provide the first functionality at the conductive structure. Driver circuitry may autonomously or manually, reversibly or irreversibly, cause the semiconductor die circuitry and the base die circuitry couple to the conductive structure. The redundant first functionality circuitry improves the operational flexibility and reliability of the semiconductor die and package.