公开(公告)号：US20210272885A1

公开(公告)日：2021-09-02

申请号：US16803887

申请日：2020-02-27

Applicant: Intel Corporation

Inventor： Kyle ARRINGTON ,  Aaron MCCANN ,  Weston K. BERTRAND

IPC: H01L23/495 ,  H01L23/498 ,  H01L25/065

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and an interposer over the package substrate. In an embodiment, the interposer comprises a ceramic. In an embodiment, the electronic package further comprises a first die over the interposer and a second die over the interposer. In an embodiment, the first die and the second die are electrically coupled together by the interposer. In an embodiment, the electronic package further comprises an integrated heat spreader (IHS) over the first die and the second die.