公开(公告)号：US20250105046A1

公开(公告)日：2025-03-27

申请号：US18473905

申请日：2023-09-25

Applicant: Intel Corporation

Inventor： Adel Elsherbini ,  Thomas L. Sounart ,  Feras Eid ,  Tushar Kanti Talukdar ,  Brandon M. Rawlings ,  Andrey Vyatskikh ,  Carlos Bedoya Arroyave ,  Kimin Jun ,  Shawna M. Liff ,  Grant M. Kloster ,  Richard F. Vreeland ,  William P. Brezinski ,  Johanna Swan

IPC: H01L21/683 ,  H01L23/00 ,  H01L25/065

Abstract: Methods of selectively transferring portions of layers between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a layer of integrated circuit (IC) components is received, and a second substrate with one or more adhesive areas is received. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.