公开(公告)号：US20250070030A1

公开(公告)日：2025-02-27

申请号：US18943420

申请日：2024-11-11

Applicant: Intel Corporation

Inventor： Sanka GANESAN ,  Ram VISWANATH ,  Xavier Francois BRUN ,  Tarek A. IBRAHIM ,  Jason M. GAMBA ,  Manish DUBEY ,  Robert Alan MAY

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic component may include a substrate having a first face and an opposing second face, wherein the substrate includes a through-substrate via (TSV); a first mold material region at the first face, wherein the first mold material region includes a first through-mold via (TMV) conductively coupled to the TSV; and a second mold material region at the second face, wherein the second mold material region includes a second TMV conductively coupled to the TSV.