公开(公告)号：US12293956B2

公开(公告)日：2025-05-06

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin Yang ,  Jimmy Chuang ,  Xicai Jing ,  Yuan-Liang Li ,  Yuyang Xia ,  David Shia ,  Mohanraj Prabhugoud ,  Maria de la Luz Belmont ,  Oscar Farias Moguel ,  Andres Ramirez Macias ,  Javier Avalos Garcia ,  Jessica Gullbrand ,  Shaorong Zhou ,  Chia-Pin Chiu ,  Xiaojin Gu

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.