公开(公告)号：US20230137684A1

公开(公告)日：2023-05-04

申请号：US17517348

申请日：2021-11-02

申请人： Intel Corporation

发明人： Jin Yang ,  David Shia ,  Jimmy Chuang

IPC分类号： H01L23/427 ,  H01L23/373

摘要： A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation assembly thermally coupled to at least one integrated circuit device, wherein the heat dissipation assembly includes a heat dissipation device having a boiling enhancement structure attached thereto with a chemically soluble adhesive material; and a thermal interface material between the boiling enhancement structure and the heat dissipation device. Utilizing a chemically soluble adhesive material allows for the boiling enhancement structure to be removed by dissolving the adhesive material, thus allowing for testing, rework, and/or replacement.

公开(公告)号：US20230180434A1

公开(公告)日：2023-06-08

申请号：US17542907

申请日：2021-12-06

申请人： Intel Corporation

发明人： David Shia ,  Jin Yang ,  Jimmy Chuang ,  Mohanraj Prabjugoud ,  Michael T. Crocker

IPC分类号： H05K7/20

CPC分类号： H05K7/203 ,  H05K7/20381

摘要： A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device includes at least one surface and at least one projection extending from the at least one surface, wherein the at least one projection includes at least one sidewall, and wherein the at least one sidewall of the at least one projection includes at least one surface area enhancement structure. Utilizing such a heat dissipation device can boost nucleate boiling, improve boiling performance, reduce superheat required to initiate boiling, boost the critical heat flux during boiling, and can translate to a greater number of integrated circuit devices/packages that can be placed into a single immersion cooling system.

公开(公告)号：US20210216121A1

公开(公告)日：2021-07-15

申请号：US17214230

申请日：2021-03-26

申请人： Intel Corporation

发明人： Kristin L. Weldon ,  David Rodriguez ,  Jin Yang ,  David Shia ,  Jimmy Chuang ,  Mohanraj Prabhugoud ,  Mark Edmund Sprenger

IPC分类号： G06F1/20 ,  H05K7/20

摘要： Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

申请人： Intel Corporation

发明人： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC分类号： H05K7/20

CPC分类号： H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

摘要： Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.