公开(公告)号：US20230091379A1

公开(公告)日：2023-03-23

申请号：US17482275

申请日：2021-09-22

Applicant: Intel Corporation

Inventor： Liang HE ,  Yeasir ARAFAT ,  Jung Kyu HAN ,  Ali LEHAF ,  Gang DUAN ,  Steve S. CHO ,  Yue DENG

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/532 ,  H01L23/528

Abstract: Embodiments disclosed herein include electronic packages with first level interconnects that comprise a first layer. In an embodiment, the electronic package comprises a package substrate and a pad on the package substrate. In an embodiment, the pad comprises copper. In an embodiment, a first layer is over the pad. In an embodiment, the first layer comprises iron. In an embodiment, a solder is over the first layer, and a die is coupled to the package substrate by the solder.