公开(公告)号：US20250123887A1

公开(公告)日：2025-04-17

申请号：US18999992

申请日：2024-12-23

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Mark Angus MacDonald ,  Mainak Banga ,  Jeffrey Christopher Sedayao ,  Ying Feng Pang

IPC: G06F9/48 ,  G06F1/20

Abstract: Systems, apparatus, and methods for energy harvesting in data centers are disclosed. An example apparatus includes interface circuitry; machine-readable instructions; and at least one processor circuit to at least one of instantiate or execute the machine-readable instructions to estimate first power consumption values for electronic components of a first rack; estimate second power consumption values for electronic components of a second rack; determine a first selection score for the first rack based on the first power consumption values and a second selection score for the second rack based on the second power consumption values; select a first electronic component of the first rack or a second electronic component of the second rack to receive a workload based on the first selection score and the second selection score; and cause the selected one of the first electronic component or the second electronic component to perform the workload.

公开(公告)号：US20240276675A1

公开(公告)日：2024-08-15

申请号：US18605305

申请日：2024-03-14

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Vishnu Prasadh Sugumar ,  Patrick L. Connor ,  Ying Feng Pang ,  Mark Lawrence Bianco

IPC: H05K7/20 ,  B05B1/16 ,  B05B15/68 ,  B05B15/70 ,  G06F1/20

CPC classification number: H05K7/20272 ,  B05B1/16 ,  B05B15/68 ,  B05B15/70 ,  G06F1/20 ,  H05K7/20281

Abstract: Systems, apparatus, articles of manufacture, and methods to mitigate hotspots in integrated circuit packages using gimballing nozzles and jet vectoring impingement are disclosed. An apparatus includes an array of nozzles to direct a cooling fluid toward an integrated circuit package. The array of nozzles includes a first nozzle and a second nozzle. The apparatus further includes a plate to carry the array of nozzles. The first nozzle is selectively moveable relative to the integrated circuit package and relative to the second nozzle. Movement of the first nozzle relative to the integrated circuit package including rotational movement and translational movement.