公开(公告)号：US10180710B2

公开(公告)日：2019-01-15

申请号：US15325609

申请日：2014-08-11

Applicant: Intel Corporation

Inventor： Yanbing Sun ,  Yongkang Wu ,  Jeff King ,  Peifeng Si

IPC: G06F1/20 ,  F24F11/79 ,  B60H1/00 ,  B60H1/22

Abstract: Apparatuses, methods and storage media associated with a plurality of cooling devices thermally coupled to a plurality of heat-generating components of an electronic device, such as a server, a configured rack of servers, or a configured rack of server elements, are disclosed herein. Each cooling device may be associated with a unique cooling zone for the components. Logic may be coupled with the plurality of cooling devices, and the logic may be configured to cause a first cooling zone of a first cooling device to overlap a second cooling zone of a second cooling device. Other embodiments may be described and/or claimed.