公开(公告)号：US20190103385A1

公开(公告)日：2019-04-04

申请号：US15721235

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： OMKAR KARHADE ,  ROBERT L. SANKMAN ,  NITIN A. DESHPANDE ,  MITUL MODI ,  THOMAS J. DE BONIS ,  ROBERT M. NICKERSON ,  ZHIMIN WAN ,  HAIFA HARIRI ,  SRI CHAITRA J. CHAVALI ,  NAZMIYE ACIKGOZ AKBAY ,  FADI Y. HAFEZ ,  CHRISTOPHER L. RUMER

IPC: H01L25/10 ,  H01L23/367 ,  H01L23/373 ,  H01L25/00

Abstract: The present disclosure is directed to systems and methods for improving heat distribution and heat removal efficiency in PoP semiconductor packages. A PoP semiconductor package includes a first semiconductor package that is physically, communicably, and conductively coupled to a stacked second semiconductor package. A thermally conductive member that includes at least one thermally conductive member may be disposed between the first semiconductor package and the second semiconductor package. The thermally conductive member may include: a single thermally conductive element; multiple thermally conductive elements; or a core that includes at least one thermally conductive element. The thermally conductive elements are thermally conductively coupled to an upper surface of the first semiconductor package and to the lower surface of the second semiconductor package to facilitate the transfer of heat from the first semiconductor package to the second semiconductor package.

公开(公告)号：US20200098666A1

公开(公告)日：2020-03-26

申请号：US16142864

申请日：2018-09-26

Applicant: INTEL CORPORATION

Inventor： ZHIMIN WAN ,  CHIA-PIN CHIU ,  POOYA TADAYON ,  JOE F. WALCZYK ,  CHANDRA MOHAN JHA ,  WEIHUA TANG ,  SHRENIK KOTHARI ,  SHANKAR DEVASENATHIPATHY

IPC: H01L23/433 ,  H01L25/065 ,  H01L23/367 ,  H01L23/31

Abstract: Heat dissipation techniques include using metal features having one or more slanted or otherwise laterally-extending aspects. The metal features include, for example, tilted metal pillars, or metal bodies or fillets having an angled or sloping sidewall, or other metal features that extend both vertically and laterally. Such metal features increase the effective heat transfer area significantly by spreading heat in the in-plane (lateral) direction, in addition to the vertical direction. In some embodiments, slanted trenches are formed in photoresist/mold material deposited over a lower die, using photolithography and a multi-angle lens, or by laser drilling mold material deposited over the lower die. The trenches are then filled with metal. In other embodiments, metal features are printed on the lower die, and then molding material is deposited over the printed features. In any such cases, heat is conducted from a lower die to an upper die and/or an integrated heat spreader.